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Chemical-Mechanical Planarization (CMP), also known as Chemical-Mechanical Polishing (Chemical-Mechanical Polishing), is a technology in the manufacturing process of semiconductor devices that uses chemical corrosion and mechanical force to Wafers or other substrate materials are planarized. This process needs to filter the large particles in the product and retain the effective particles for grinding. The size of the intercepted particles directly affects the grinding effect. We have made products with different precisions for different sizes of particles to ensure the grinding effect.
